Engineering Mechanics

International Conference

Proceedings Vol. 15 (2009)


May 11 – 14, 2009, Svratka, Czech Republic
Editors: Jiří Náprstek and Cyril Fischer

Copyright © 2009 Institute of Theoretical and Applied Mechanics, Academy of Sciences of the Czech Republic, v.v.i., Prague

ISBN 978-80-86246-35-2 (printed, Extended Abstracts)
ISSN 1805-8248 (printed)
ISSN 1805-8256 (electronic)

list of papers scientific commitee

The changes in compression strength of wood along and across grain caused by an impact of damage to wood by wood-damaging fungi
J. Frankl
pages 261 - 272, full text

The contribution is dedicated to monitoring the effect of time of impact of wood-damaging fungi on mechanical characteristics of spruce wood. Results of mechanical tests are presented in the article - compression strength along grain and compression strength across grain in tangential direction. The tests were carried out on standard samples 20x20x30 mm. The testing samples were exposed, in ideal growth conditions for variable times (5-90 days), to impact of wood-damaging fungi. Serpula lacrymans (wood-damaging fungi with brown, dry-decay) and Trametes versicolor (wood-damaging fungi with white, corrosive decay) were selected for the test.

back to list of papers

Text and facts may be copied and used freely, but credit should be given to these Proceedings.

All papers were reviewed by members of the scientific committee.

imce   Powered by Imce 3.13  © 2020, Pavel Formánek, Institute of Thermomechanics AS CR, v.v.i. [generated: 0.0289s]